The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2004

Filed:

May. 13, 2002
Applicant:
Inventors:

Masahiro Nomura, Tokyo, JP;

Toshiyuki Oga, Tokyo, JP;

Takanobu Gido, Fukushima, JP;

Takao Ono, Saitama, JP;

Yoshiyuki Takahashi, Saitama, JP;

Rika Sasaki, Aomori, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/5363 ; B23K 3/5365 ; B23K 3/5368 ;
U.S. Cl.
CPC ...
B23K 3/5363 ; B23K 3/5365 ; B23K 3/5368 ;
Abstract

There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that tend to be generated by the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, −40° C. to +85° C.), or that may be caused to generate by voltage noises to be generated by the fluctuation of parasitic capacity between circuits which may be caused to generate due to a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, acrylic resin for preventing the generation of voltage noises in electronic devices. The circuit board is accompanied with a residual film of such a flux.


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