The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 2004

Filed:

Oct. 23, 2002
Applicant:
Inventors:

John R. Debesis, Penfield, NY (US);

Larry L. Lapa, Rochester, NY (US);

Edwin A. Mycek, Scottsville, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/175 ;
U.S. Cl.
CPC ...
B41J 2/175 ;
Abstract

A system and method for the fabrication of a fluid, gas and/or vacuum flow system ( ) having a laminate gasket manifold ( ) containing a plurality of bi-directional fluid-flow channels ( ) therein. Initially, a photoimagable polyimide dry film resist layer ( ) is applied to one or more stiffening elements ( ) in order to form laminate sub-layers ( ). The resist is then patterned to form a plurality of openings therein. Selectively, the laminate sub-layers are etched to form alignment apertures ( ) therein. The resist-coated sub-layers ( ) are then stacked such that the alignment apertures ( ) therein are aligned to each other, respectively, to form bi-directional fluid-flow channels ( ). Heat and pressure are then applied to the stack of laminate sub-layers ( ) at 70-75 degrees C. in a vacuum laminator for 10 to 30 seconds. Additional parts, such as a silicon aperture structure ( ) and a substrate, or mounting block ( ), are bonded to the laminate gasket manifold ( ) via a die bonder at 160 degrees C. for approximately five minutes. If such additional parts are added, forming a system ( ), then the system ( ) is cured via a post bake at 160 degrees C. for one hour utilizing a static pressure, such as a dead weight, in order to press all parts together. Thus, the post bake results in a complete cross-link of the bonding material ( ), and may be applied to the laminate gasket manifold ( ) should additional parts not be added.


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