The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2004

Filed:

Mar. 17, 2003
Applicant:
Inventors:

Ronald T. Gibbs, Paoli, PA (US);

Grant M. Smith, Bryn Athyn, PA (US);

Assignee:

Unisys Corporation, Blue Bell, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A structure for removing heat from a packaged electronic component. The structure includes three, main elements. First, a heat sink has a pedestal with opposing ends and a plurality of fins separated by spaces and disposed on the pedestal. The heat sink dissipates heat generated by the packaged electronic component. Second, parallel rails are disposed adjacent the opposing ends of the pedestal, each rail having a catch. Third, a spring clip has (a) end hooks which engage the catches to retain the spring clip on the rails, and (b) a strut extending between the hooks, fitting into the space between adjacent fins, and including an apex which contacts substantially centrally the pedestal and applies a force pressing the heat sink toward the packaged electronic component. Thus, the heat sink is removably attached at least indirectly to the packaged electronic component. Also disclosed is a method of using the structure.


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