The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2004

Filed:

Nov. 05, 2001
Applicant:
Inventor:

David M. Weber, Colorado Springs, CO (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/512 ;
U.S. Cl.
CPC ...
G01R 1/512 ;
Abstract

A mechanism if provided for testing newly-manufactured integrated circuits at the wafer stage. Built-in self-test circuitry is used to test each of the die on a wafer in parallel. Then, when a defect is detected, the die marks itself (e.g., by physically destroying a portion of itself through burnout). The present mechanism eliminates the inefficiencies of serial testing of die and of mechanical latency as each die is positioned for testing.


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