The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2004

Filed:

Sep. 20, 2002
Applicant:
Inventor:

Julien Vittu, Grenoble, FR;

Assignee:

STMicroelectronics S.A., Montrouge, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/10203 ;
U.S. Cl.
CPC ...
H01L 3/10203 ;
Abstract

Optical semiconductor package ( ) and process for fabricating an optical semiconductor package, in which an electrical connection support plate has a through-passage ( ); a semiconductor component ( ), a front face ( ) of which has an optical sensor and which is fixed to a rear face of the plate in such a way that its optical sensor is situated opposite the through-passage; electrical connection ( ) connects the optical component to the support plate; the component is encapsulated on the rear face of the support plate; a lid ( ), which is at least partially transparent, is fixed to a front face of the support plate and covers the through-passage; and external electrical connections ( ) are located on an exposed part of the support plate. Furthermore, another semiconductor component ( ) may be fixed to the rear face of the support plate ( ) and electrically connected, to the latter, this component also being encapsulated ( ).


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