The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Jul. 16, 2002
Applicant:
Inventors:
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 ; H01R 1/204 ;
U.S. Cl.
CPC ...
H05K 1/11 ; H01R 1/204 ;
Abstract
A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.
Kikuchi, Shunichi. (2004). Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device (U.S. Patent No. 6787711). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6787711
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile