The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Feb. 19, 2002
Applicant:
Inventor:
Tetsuo Hirakawa, Kokubu, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 1/03 ;
Abstract
A ceramic circuit board that protects a metallized wiring layer from fusion when a large electric current is applied thereto. The ceramic circuit board includes a ceramic substrate, a plurality of metallized wiring layers formed on the ceramic substrate, and a metal circuit plate made of copper, which is attached to part of the metallized wiring layers. The condition, S≧6×10 i , is fulfilled in the ceramic circuit board, whereby S (mm ) is the sectional area of the metal circuit plate and i (A) the value of a flowing electric current.