The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Oct. 16, 2002
Applicant:
Inventors:
Assignee:
Yazaki Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/352 ; H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/352 ; H01L 2/3495 ;
Abstract
A chip part ( ) is mounted on bus bars ( ), and connection portions ( ) of the chip part ( ) are soldered to the bus bars ( ), respectively. At this time, recesses ( ) are beforehand formed respectively in soldering lands of the two spaced-apart bus bars each corresponding to a predetermined solder wetting area. The chip part is soldered to the bus bars in such a manner that the connecting portions are spaced apart from inner edges of these recesses, respectively, thereby forming a solder fillet between at least part of each of the recesses and the corresponding connecting portion of the chip part.