The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2004

Filed:

Aug. 16, 2002
Applicant:
Inventors:

Jozef J. VanDun, Freeport, TX (US);

Patrick J. Schouterden, Terneuzen, BE;

Peter F. M. van den Berghe, Graauw, NL;

Ruddy Nicasy, Tessenderlo, BE;

Johan Vanveorden, Diepenbeek, BE;

Frederick E. L. Gemoets, Terneuzen, BE;

Kalyan Sehanobish, Lake Jackson, TX (US);

Noorallah Jivraj, Lake Jackson, TX (US);

Ravi S. Dixit, Lake Jackson, TX (US);

Assignee:

Dow Global Technologies, Inc., Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 2/300 ; C08L 2/304 ;
U.S. Cl.
CPC ...
C08L 2/300 ; C08L 2/304 ;
Abstract

The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWD , of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, T , of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.


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