The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Aug. 20, 2003
Jin-Sung Chung, Gyeonggi-do, KR;
Abstract
A metal interconnection for an integrated circuit device is fabricated by forming a trench in an integrated circuit substrate and a via hole beneath a portion of the trench. The trench includes a trench sidewall and the via hole includes a sacrificial film therein. A buffer layer is formed on the trench sidewall. At least some of the sacrificial film is removed from the via hole by etching the sacrificial film through the trench that includes the buffer layer on the trench sidewall. The metal interconnection is formed in the via hole from which at least some of the sacrificial film has been removed, and in the trench. The buffer layer may use material having etch selectivity to an etchant which is used when removing the sacrificial film, to thereby protect the trench sidewall when removing the sacrificial film.