The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 2004
Filed:
Jun. 25, 2001
Applicant:
Inventor:
Mika Kiritani, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/502 ; B29C 4/514 ; B29C 7/078 ; B29C 3/318 ;
U.S. Cl.
CPC ...
B29C 4/502 ; B29C 4/514 ; B29C 7/078 ; B29C 3/318 ;
Abstract
A resin tape substrate with a semiconductor chip mounted thereon is put to an attachment area surface of a cavity bottom surface, and a plurality of suction holes connected to a suction system are disposed in the attachment area surface, wherein the attachment area surface of the cavity is formed in a semiconductor resin mold, so that the molten resin given into the cavity does not flow into the back surface of the resin tape substrate which is sucked on the attachment area surface in the mold.