The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Mar. 26, 2003
Hideki Ichikawa, Shiki-gun, JP;
Mamoru Okanishi, Shiki-gun, JP;
Terumitsu Santo, Gojo, JP;
Toshihiko Yoshida, Nara, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
There is provided is a semiconductor laser device capable of simplifying fabricating processes with a simple construction and easily mounting two semiconductor laser elements and a monitoring PD on a compact package and a wire bonding method for the semiconductor laser device. There are provided a stem provided with a plurality of lead pins through , a sub-mount that is die-bonded onto the stem and has its surface formed integrally with a monitoring PD and two semiconductor laser elements and that are die-bonded onto the sub-mount and have emission light monitored by the monitoring PD . A first bonding surface i.e. anode electrode of the monitoring PD and a second bonding surface i.e. end surface of a lead pin that is approximately perpendicular to the first bonding surface are wire-bonded to each other.