The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Aug. 22, 2003
Applicant:
Inventors:
David T. Price, Gresham, OR (US);
Jayashree Kalpathy-Cramer, West Linn, OR (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/18238 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/18238 ; H01L 2/144 ;
Abstract
The present invention provides a method for forming interconnect lines and conductors and passive devices in the fabrication of an integrated circuit. A gap is created in the patterning of a first layer. The gap is filled by a dielectric material so that an encapsulated conduit is formed in the gap. The encapsulated conduit is filled with a conductor by chemical vapor deposition processes or other deposition processes, the filling facilitated by forming via holes to intersect the conduit, and then filling the via holes. The conductor filled conduit can be used as a resistor, fuse, inductor, or capacitor.