The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Apr. 11, 2002
Applicant:
Inventors:
Norito Umehara, Ibaraki, JP;
Masazumi Amagai, Oita, JP;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/148 ;
U.S. Cl.
CPC ...
H01L 2/148 ;
Abstract
A method of producing semiconductor devices including the steps of providing a semiconductor wafer of substantially uniform thickness , providing a heat-radiating plate , and attaching the heat-radiating plate to the semiconductor wafer. The assembled wafer and heat-radiating plate are diced into individual semiconductor integrated circuits having individual heat radiating plates attached thereto.
Umehara, Norito. (2004). Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits (U.S. Patent No. 6784022). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6784022
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile