The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 31, 2004

Filed:

Jul. 03, 2002
Applicant:
Inventors:

Koichi Fujimaru, Otsu, JP;

Toshio Yoshimura, Fukuoka, JP;

Nobuo Matsumura, Kusatsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 7/706 ; H01L 2/3495 ; B32B 1/902 ;
U.S. Cl.
CPC ...
C08L 7/706 ; H01L 2/3495 ; B32B 1/902 ;
Abstract

A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 &mgr;m or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.


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