The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Feb. 22, 2002
Siemens Aktiengesellschaft, Munich, DE;
Abstract
A method and device can be used to pattern both regions of a printed circuit board which are provided for coarse conductor structures and regions which are provided for relatively fine conductor structures of the printed circuit board. In each case, this can be done via laser processing. Both regions are firstly coated with a continuous metallization layer and covered with an etch resistor. The coarse conductor structures are predefined with a laser beam with a relatively long wavelength by exposing the metal surfaces which are not required. In addition, the fine conductor structures are also pre-shaped by processing the etch resist with a laser beam with a relatively short wavelength. Then, in a common etching process, all the exposed surface regions of the metal layer are etched away so that only the coarse and fine conductor track structures which are covered by the remaining etch resist are left. As a result of the removal of the rest of the etch resist, the surfaces of the conductor tracks which are produced are then exposed.