The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6783623 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 31, 2004

Filed:

Oct. 23, 2002
Applicant:
Inventors:

Jeremy E. Morin, Florence, SC (US);

Krishnaraju Varadarajan, Florence, SC (US);

Assignee:

Sonoco Development, Inc., Hartsville, SC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/124 ; D21H 2/730 ;
U.S. Cl.
CPC ...
B32B 3/124 ; D21H 2/730 ;
Abstract

A method of making a spirally wound dry bonded paperboard structure. The method includes adding a radio frequency active adhesive to the paperboard pulp stock during the paperboard fabrication process to first produce an RF active adhesive impregnated paperboard. The impregnated paperboard is then exposed to an RF energy field prior to or during winding, which activates the adhesive. The invention eliminates the need to apply a water-based adhesive to the paperboard prior to forming the structure, thereby reducing water migration into the paperboard.


Find Patent Forward Citations

Morin, Jeremy. (2004). Method of making a dry bonded paperboard structure (U.S. Patent No. 6783623). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6783623

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…