The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2004
Filed:
Sep. 30, 2002
Hideki Ohsumi, Shizuoka, JP;
Yoshimi Wada, Shizuoka, JP;
Yazaki Corporation, Shizuoka, JP;
Abstract
In a mold for pressing an electric-wire clamping portion of a terminal, a lower side-wall mold part and an upper side-wall mold part are provided for pressing side walls connected to the electric-wire clamping portion. A pressure face substantially continuously connected to a pressure face of an upper conductor mold part is provided on one end side of the upper side-wall mold part. A taper face is provided on the other end side of the upper side-wall mold part so as to be enlarged toward the other end. Accordingly, side walls pressed between the lower side-wall mold part and the upper side-wall mold part are deformed so that the quantity of deformation at one end is near the quantity of compressive deformation of the electric-wire clamping portion and so that the quantity of deformation is reduced gradually toward the other end side. Thus, local stress concentration is not caused in the side walls so that cracks are prevented from occurring in the side walls.