The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Nov. 12, 2002
Applicant:
Inventors:
Assignee:
Denso Corporation, Kariya, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/750 ; G06F 9/45 ;
U.S. Cl.
CPC ...
G06F 1/750 ; G06F 9/45 ;
Abstract
A semiconductor electronic part, having a lot of bumps allocated in a checkered pattern, is solder-mounted on a multilayer circuit board. In the multilayer circuit board, a first wiring pattern linked with a first land is finer than a second wiring pattern linked with a second land. Only one first wiring pattern is passable between lands. The second lands are allocated in the outmost line on the uppermost layer of the multilayer circuit board. In the semiconductor electronic part, bumps connectable with the second lands are allocated in the outermost line.