The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Nov. 30, 1999
Applicant:
Inventor:
Kenji Uchiyama, Hotaka-machi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02F 1/1345 ; H05K 1/14 ;
U.S. Cl.
CPC ...
G02F 1/1345 ; H05K 1/14 ;
Abstract
In a compression-bond-connection substrate having a configuration wherein a plurality of wiring layers are formed, elevated compensation patterns having substantially the same thickness as that of backside wiring patterns are formed in positions corresponding to the backsides of substrate-side terminals to be conductively connected to opposing-side terminals on a compression-bonding-side surface of the compression-bond-connection substrate. Since uniform pressure is exerted on the substrate-side terminals when pressure is applied in compression-bonding, a highly reliable compression-bonding connected assembly can be stably obtained.