The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Apr. 03, 2001
Applicant:
Inventor:
Makoto Nonaka, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A semiconductor device having a plurality of wiring layers in a multi-layered structure, includes an inner area at a surface and a pad area surrounding the inner area therein, and further includes a device fabricated below the pad area. The device is comprised of at least one of a bypass capacitor, a protection device, and an input/output device. For instance, the bypass capacitor is comprised of metal wire layers arranged below the pad area.