The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Oct. 25, 2002
Applicant:
Inventors:
Masanobu Ikeda, Kawasaki, JP;
Takashi Suzuki, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract
A wiring which is formed by filling a via hole and a wiring trench with Cu via a base film is formed by a damascene method. Thereafter, an SiC:H film is formed to cover an upper surface of the wiring. At this time, an N atom content thereof is controlled to be 8 (atm %) to 20 (atm %) by adding an N-containing gas at the time of forming the SiC:H film, thereby causing the film density of the SiC:H film to be 2.1 (g/cm ) or higher.