The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Jun. 08, 2000
William James Palmteer, North Andover, MA (US);
The Whitaker Corporation, Wilmington, DE (US);
Abstract
A solder-coated article is described. The article comprises (1) a dielectric core having a largest dimension ranging from 1 to 1000 microns; (2) a solderable metal layer over the core; and (3) a solder layer over the metal layer. Preferably, the dielectric core is a spherical core of ceramic or glass material that ranges from 25 to 200 microns in diameter. Copper and nickel are preferred materials for the solderable metal layer. The solder is preferably selected from a solder comprising lead and tin and a solder comprising lead and indium, more preferably a 63% Sn-37% Pb solder, a 95% Pb-5% Sn solder, or a 50% Pb-50% In solder. Also described are modified substrates and (solder bonded assemblies) that can be created using such solder-coated articles, as well as a procedure for making the same.