The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2004

Filed:

Dec. 18, 2001
Applicant:
Inventors:

Masayuki Ikeno, Maebashi, JP;

Masaya Arakawa, Annaka, JP;

Kouichi Tanaka, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 8/305 ; C08L 8/307 ; C08K 3/36 ;
U.S. Cl.
CPC ...
C08L 8/305 ; C08L 8/307 ; C08K 3/36 ;
Abstract

An organopolysiloxane composition for molding purposes is provided which includes: (A) an organopolysiloxane with at least two alkenyl groups bonded to silicon atoms, (B) a straight chain organopolysiloxane with a hydrogen atom bonded to a silicon atom at both terminals, (C) an organohydrogenpolysiloxane with at least three hydrogen atoms bonded to silicon atoms within a single molecule and including a RHSiO unit and a R XSiO unit (wherein R is an unsubstituted or a substituted monovalent hydrocarbon group with no alkenyl groups, and X represents either a hydrogen atom or a group represented by R as defined above) within the molecule, (D) a hydrosilylation reaction catalyst, and (E) finely powdered silica, wherein the total number of hydrogen atoms bonded to silicon atoms within the constituent (B) and the constituent (C) ranges from 1 to 5 per alkenyl group within the constituent (A), and the number of hydrogen atoms bonded to silicon atoms within the constituent (B) accounts for 20 to 70 mol % of the combined number of hydrogen atoms bonded to silicon atoms within the constituent (B) and the constituent (C). This composition displays superior mold releasability relative to materials such as urethane resins, epoxy resins, dicyclopentadiene resins and polyester resins, and moreover also displays superior elongation at shearing and tear strength, and can be suitably used as a highly durable mold composition.


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