The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Dec. 13, 2000
Lary R. Larson, Gold Canyon, AZ (US);
Medtronic, Inc., Minneapolis, MN (US);
Abstract
A method for forming a stackable wafer for use in an implantable device is provided. The method comprises forming an opening extending substantially through the wafer. Thereafter, conductive material is deposited within the opening to substantially fill the opening. A bump is then formed on an upper surface of the wafer adjacent the conductive material, and a contact pad is formed on a lower surface of the wafer adjacent the conductive material. A second wafer formed using substantially the same process may then be stacked on top of the first wafer with the bump of the first wafer being in contact with the contact pad of the second wafer. A soldering process may then be used to couple the adjacent pad and wafer for physically mounting the wafers and providing electrical connectivity therebetween.