The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Sep. 03, 2002
Applicant:
Inventor:
Jong-Chol Seol, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
The present invention provides a bonding pad for an optical semiconductor device, including: a first supplementary adhesive layer made of Si N , being formed on a semiconductor substrate; a bonding pad layer made of benzocyclobutene, being formed on the first supplementary adhesive layer; a second supplementary adhesive layer made of Si N , being formed on the bonding pad layer; and a metallic electrode layer formed on the second supplementary adhesive layer.