The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Sep. 06, 2002
Marc Chason, Schaumburg, IL (US);
Paul Brazis, South Elgin, IL (US);
Krishna Kalyanasundaram, Chicago, IL (US);
Daniel Gamota, Palatine, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A wafer ( ) having integrated circuit elements formed therein is thinned and a first carrier ( ) is adhered thereto. The first carrier ( ) facilitates handling of the thinned wafer ( ). A second carrier ( ) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die ( ). Once the thinned die is mounted to a desired substrate ( ), the first carrier ( ) is readily removed. In one embodiment, the first carrier ( ) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.