The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 24, 2004

Filed:

May. 17, 2000
Applicant:
Inventors:

Tsutomu Kono, Kawasaki, JP;

Makoto Iida, Kawasaki, JP;

Naozumi Hatada, Yokohama, JP;

Yoshimichi Nishimura, Hitachinaka, JP;

Masayuki Doki, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 1/3405 ;
U.S. Cl.
CPC ...
H01R 1/3405 ;
Abstract

One or more pre-molded resin inserts ( ) are placed in a metal mold and an outer molded resin body ( ) is formed about the insert. The cooling speed is increased by: forming the insert with projections ( ) to space a rear part of the insert from walls of the metal mold so that molten resin flows into position about the insert; forming convex parts ( ) on portions of the outer resin body adjacent the insert ( ); forming recesses ( ) in the molded outer housing, the recesses extending between the inserts and formed to receive fins of a front metal mold part; forming plural pin carrier inserts as one unit; or forming the inserts as layered bodies. This increases heat transfer from the outer body molten material to the cooler metal mold parts at regions adjacent to the pre-molded insert.


Find Patent Forward Citations

Loading…