The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 2004
Filed:
Jan. 17, 2002
Raymond Gales, Harlange, LU;
Damien Michel, Bromont, CA;
Circuit Foil Luxembourg Trading Sarl, Luxembourg, LU;
Abstract
A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting resin layer, the functional copper foil being electro-deposited with a uniform thickness of more than 4 &mgr;m but less than 10 &mgr;m on the carrier foil, the functional copper foil having a front side facing the carrier foil and an opposite backside which is coated with the non-reinforced thermosetting resin layer. The method further involves laminating the composite foil with the non-reinforced thermosetting resin layer on the core board and removing the carrier foil from the functional copper foil in order to uncover the front side of the functional copper foil. A CO laser source drills holes from the uncovered front side of the functional copper foil through the functional copper foil and the non-reinforced thermosetting resin layer to form microvias.