The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2004

Filed:

Jul. 20, 2000
Applicant:
Inventors:

Mark F. Sauder, Chippewa Falls, WI (US);

Michael L. Anderson, Eau Claire, WI (US);

Eric C. Fromm, Eau Claire, WI (US);

Assignee:

Silicon Graphics, Inc., Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/200 ;
U.S. Cl.
CPC ...
G06F 1/200 ;
Abstract

A method and apparatus for accessing memory-mapped registers that are distributed across a large integrated circuit. Some embodiments provide a method for accessing memory-mapped registers that are distributed across a first integrated circuit, the first integrated circuit including a plurality of logic subset modules, wherein each of the plurality of logic subset modules includes one or more memory-mapped registers. This method includes receiving a memory-mapped register access request into the first integrated circuit, serially transmitting, through each of the plurality of logic subset modules, a first plurality of data packets based on the memory-mapped register access request, wherein the first plurality of data packets includes an address specification for a memory-mapped register associated with a first one of the logic subset modules, and within the first logic subset module, accessing the memory-mapped register associated with the first logic subset module. Another aspect of the present invention provides an MMR circuit for accessing memory-mapped registers that are distributed across a first integrated circuit chip, the first integrated circuit chip including a plurality of logic subset modules.


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