The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2004

Filed:

Feb. 04, 2000
Applicant:
Inventors:

Kouji Arikawa, Hitachinaka, JP;

Susumu Tachibana, Hitachinaka, JP;

Kazuo Shigematsu, Hitachinaka, JP;

Hideo Taguchi, Takasaki, JP;

Shigeru Nakamura, Kokubunji, JP;

Tetsuya Tomobe, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11B 7/00 ;
U.S. Cl.
CPC ...
G11B 7/00 ;
Abstract

In a laser module holding a semiconductor laser chip and a reflecting surface, to perform positioning on the semiconductor laser chip with high precision, and reduce the period of production, so as to realize downsizing and cost reduction, reflecting surfaces provided on a silicon substrate has a step portion, and the reflecting surfaces are used as reflecting surface for laser emission light and laser chip positioning surface, for high precision positioning. Further, in a laser module which requires a high level power for recording, slopes opposite to side surfaces of the semiconductor laser chip in a lengthwise direction have a step portion, and in wiring of lower electrodes of the laser chip from the bottom of the sink to an upper portion of the silicon substrate, a slope having an angle with respect to the laser chip lengthwise direction is formed as a gentle slope, then wiring is made via the slope, thus mitigating occurrence of migration.


Find Patent Forward Citations

Loading…