The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2004
Filed:
Sep. 30, 2002
Applicant:
Inventors:
Ruben Madrid, Lapu-lapu, PH;
Maria Clemens Y. Quinones, Cebu, PH;
Assignee:
Fairchild Semiconductor Corporation, South Portland, ME (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/3495 ; H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/3495 ; H01L 2/144 ;
Abstract
A semiconductor die package including a semiconductor die including a first surface, a second surface, and a vertical power MOSFET having a gate region and a source region at the first surface a drain region at the second surface. A drain clip having a major surface is electrically coupled to the drain region. A gate lead is electrically coupled to the gate region. A source lead is electrically coupled to the source region. A non-conductive molding material encapsulates the semiconductor die. The major surface of the drain clip is exposed through the non-conductive molding material.