Semiconductor integrated circuit modules, manufacturing methods and usage thereof

Abstract

In the past, a power supply distance between a power source and an LSI package could not be shortened and power supply variations could easily produce an adverse effect. To reduce the power supply distance between the LSI and power supply module the power supply module is mounted on an upper surface of the LSI package. As a result, the power source noise can be reduced, the efficiency and response rate of the power source unit are high, and the generated electromagnetic field can be reduced. Moreover, since each LSI package has a power supply module required therefore, the number of required power source types (voltage types) on the substrate with the package mounted thereon can be decreased. As a result, the mounting efficiency can be increased and the substrate can be manufactured at a low cost.