The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2004

Filed:

Nov. 07, 2001
Applicant:
Inventors:

Hiroshi Ito, Takasago, JP;

Hidetoshi Odaka, Takasago, JP;

Hiroshi Iwakiri, Kobe, JP;

Fumio Kawakubo, Kobe, JP;

Hideharu Jyono, Kobe, JP;

Assignee:

Kaneka Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 8/312 ;
U.S. Cl.
CPC ...
C08L 8/312 ;
Abstract

The present invention provides a novel sealant and a novel curable resin composition providing for sufficiently high mechanical strength, adhesive strength, rubber elasticity and good workability and a direct glazing method utilizing the composition, which comprises (I) a reactive silicon group-containing polyether oligomer such that the reactive silicon group exists exclusively at the molecular chain terminus and the introduction rate of the reactive silicon group into the molecular chain terminus is not less than 85% as determined by H-NMR analysis and (II) a reinforcing filler.


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