The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 2004
Filed:
Jul. 22, 2002
Applicant:
Inventor:
Seiji Nakagawa, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/131 ; H01L 2/1469 ;
U.S. Cl.
CPC ...
H01L 2/131 ; H01L 2/1469 ;
Abstract
A material film forming method is provided which comprises coating a liquid material on a surface of a substrate to form a material film of the liquid material the on the surface of the substrate, while rotating the substrate, and drying the material film, while rotating the substrate and letting air or nitrogen gas blow onto a predetermined area of the material film.
Nakagawa, Seiji. (2004). Method and device of forming a film using a coating material and method of manufacturing a semiconductor device (U.S. Patent No. 6777350). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6777350
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile