The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Sep. 28, 1999
Applicant:
Inventor:
Ming-Tung Shen, Taipei, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ;
Abstract
A semiconductor chip module includes a chip-mounting member having opposite first and second surfaces, a set of circuit traces, and a plurality of plated through holes that extend through the first and second surfaces and that are connected to the circuit traces. A dielectric tape member bonds adhesively a semiconductor chip on the chip-mounting member. A first conductor unit connects electrically contact pads on a pad mounting surface of the semiconductor chip and the circuit traces. A plurality of solder balls are disposed on one of the first and second surfaces of the chip-mounting member, are aligned with and are connected to the plated through holes in the chip-mounting member, respectively.