The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Jan. 31, 2002
Aisin Seiki Kabushiki Kaisha, Kariya, JP;
Abstract
A thermoelectric module which includes case , heat-radiation side insulating substrate , heat-absorption side insulating substrate , first soldering layer formed of a first soldering agent to connect the heat-radiation side insulating substrate and the case , a plurality of P-type and N-type semiconductor chips interposed between the heat-radiation side insulating substrate and the heat-absorption side insulating substrate , the plurality of P-type and N-type semiconductor chips being arranged alternately, and a second soldering layer ( ) formed of a second soldering agent to connect the heat-radiation side insulating substrate and one end of each of the plural P-type and N-type semiconductor chips (the heat-absorption side insulating substrate and the other end of each of the plural P-type and N-type semiconductor chips), the first soldering agent and the second soldering agent being identical in raw material.