The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2004

Filed:

Jul. 16, 2003
Applicant:
Inventors:

Andre Egli, Staefa, CH;

Anja Vinckier, Vlezenbeek, BE;

Jochen Heber, Kriens, CH;

Wan Zhang, Luzern, CH;

Assignee:

Shipley Company, L.L.C., Marlborough, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 ; C25D 3/60 ;
U.S. Cl.
CPC ...
C25D 5/02 ; C25D 3/60 ;
Abstract

The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.


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