The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Apr. 01, 2002
Applicant:
Inventors:
Stephen Michael Campbell, Winneconne, WI (US);
Kile Patrick Mangan, Appleton, WI (US);
Mark Michael Mleziva, Appleton, WI (US);
Kent Allan Franklin, Appleton, WI (US);
Adrian Roy Eggen, Appleton, WI (US);
Assignee:
Kimberly-Clark Worldwide, Inc., Neenah, WI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 6/508 ;
U.S. Cl.
CPC ...
B29C 6/508 ;
Abstract
A method for ultrasonically bonding thermoplastic materials, for example melt-compatible thermoplastic materials, wherein the thermoplastic materials are preheated prior to entering an ultrasonic bonding means, thereby substantially increasing an ultimate bond strength established between the materials during the ultrasonic bonding process.
Quick Actions:
Campbell, Stephen. (2004). Method for obtaining improved ultrasonic bond strength (U.S. Patent No. 6773527). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6773527
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile