The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 10, 2004

Filed:

Feb. 01, 2001
Applicant:
Inventors:

Keiichi Iiyama, Osaka, JP;

Takashi Noda, Hyogo, JP;

Shinji Murakami, Kyoto, JP;

Yutaka Harada, Kyoto, JP;

Takuya Oka, Osaka, JP;

Masaru Tanichi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 1/906 ;
U.S. Cl.
CPC ...
G06K 1/906 ;
Abstract

An electronic circuit module formed of an antenna coil and an integrated circuit provided on a circuit board is provided inside a hollow resin case formed of a first part and a second part. A first slit leading into the hollow portion is provided in one side face of the resin case formed of the first and second parts joined to each other. Since the electronic circuit module is not exposed to high temperatures and high pressure during the manufacturing process, defects such as the breakage of the integrated circuit or the disconnection of the antenna coil can be avoided. Since the slit leading into the hollow portion is provided, the hollow portion does not swell by the temperature increase. In addition, pinholes do not tend to be formed during the joining of the first and second parts. Thus, a contactless data carrier with an excellent electrostatic withstand voltage characteristic can be provided.


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