The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Sep. 18, 2002
Applicant:
Inventor:
Veikko Polvi, Pori, FI;
Assignee:
Outokumpu Oyj, Espoo, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/512 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/512 ; B23K 3/102 ;
Abstract
A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil ( ) comprising surface layers ( ) and an intermediate layer ( ) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.