The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 2004
Filed:
Jan. 28, 2002
Shiuh-Hui Steven Chen, Lake Zurich, IL (US);
Cheryl Field, Kildeer, IL (US);
Didier R. Lefebvre, Mundelein, IL (US);
Joe Pin Wang, Long Grove, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of separating a thin die ( ) from a support body ( ) of a semiconductor wafer ( ). The thin die ( ) being initially attached to the support body ( ) by an attachment mechanism ( ). The attachment mechanism may be a plurality of tethers ( ) that extend between the thin die ( ) and the support body ( ). The method may include the steps of: positioning the wafer ( ) on a rigid backing ( ) having a hole ( ), the hole ( ) positioned beneath the thin die ( ); positioning a tip ( ) of a handler ( ) above the thin die ( ), the tip ( ) having a passageway ( ) to a vacuum source; positioning an ejection pin ( ) in a spaced apart relationship beneath the thin die ( ); moving the tip ( ) of the handler ( ) downward toward the thin die ( ) to break the attachment mechanism ( ) and clamp the thin die ( ) between the tip ( ) of the handler ( ) and the ejection pin ( ); and moving the ejection pin ( ) upward in the direction of the tip ( ) of the handler ( ) until the thin die ( ) is extracted from the wafer ( ).