The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2004
Filed:
Feb. 28, 2001
Yoshihiro Izumi, Kashihara, JP;
Yoshimasa Chikama, Kyoto, JP;
Satoshi Kawashima, Omiya, JP;
Takaharu Hashimoto, Omiya, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Abstract
There is provided is a metal line structure in which no defect of blistering occurs on a surface of a Cu/Ni film or a Cu/Au/Ni film even if an Ni plating thickness is reduced. According to this metal line , in a Cu/Au/Ni film structure in which an Au film and a Cu film are successively laminated by electroless plating on an Ni film formed by electroless plating, the Ni film has a phosphorus content x of 10 wt %≦x≦15 wt %. It was discovered through experiments that the so-called high phosphorus content type Ni film having a phosphorus content x of 10 to 15 percent by weight became a fine smooth film under a condition of a film thickness of 0.1 &mgr;m or greater.