The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 2004

Filed:

Dec. 27, 2001
Applicant:
Inventors:

Hiroki Takeuchi, Komaki, JP;

Toshifumi Kojima, Komaki, JP;

Kazushige Ohbayashi, Nagoya, JP;

Hisahito Kashima, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 ; H01L 5/918 ; C08L 6/302 ; C08G 5/918 ; B32B 3/00 ;
U.S. Cl.
CPC ...
H05K 3/46 ; H01L 5/918 ; C08L 6/302 ; C08G 5/918 ; B32B 3/00 ;
Abstract

A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s after allowing to stand for 24 hours at 25° C.±1° C.


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