The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2004
Filed:
Jan. 15, 2003
Jason Woloszyn, Westbrook, ME (US);
Michael Harley-Stead, Portland, ME (US);
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
Chemical mechanical polishing (CMP) produces thickness variations over the surface of a chip or die that depends on many factors. The present invention provides for characterization of the thickness variations over the surface area, and accepting these variations in the detailed design of the components that are to be distributed over the entire surface of the die. Any device with parameters that depend on the layer thickness that is subject to CMP will have variations in those parameters depending upon where the device is located on the die. The present invention characterizes the thickness variations and modifies the physical design of other mechanical aspects of the device so as to compensate for the thickness variations. The result is devices that have acceptable parameters regardless of their location on the chip.