The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2004
Filed:
Dec. 17, 2001
Ludwig Böhm, Hattersheim, DE;
Joachim Berthold, Kelkheim, DE;
Johannes-Friedrich Enderle, Frankfurt, DE;
Elke Damm, Frankfurt, DE;
Ulrich Schulte, Kelkheim, DE;
Basell Polyolefine GmbH, , DE;
Abstract
A polyethylene molding material has a bimodal molecular weight distribution with an overall density of ≧0.948 g/cm and a melt flow index MFI of ≦0.2 dg/min. The molding material comprises from 35 to 65% by weight of low-molecular-weight ethylene hompolymer A having a viscosity number VN in the range from 40 to 90 cm /g, a melt flow index MFI in the range from 40 to 2000 dg/min and a density d of ≧0.965 g/cm . Also included is from 35 to 65% by weight of high-molecular-weight ethylene copolymer B having a viscosity number VN in the range from 500 to 2000 cm /g, a melt flow index MFI in the range from 0.02 to 0.2 dg/min and a density d in the range from 0.922 to 0.944 g/cm .