The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Oct. 10, 2001
Applicant:
Inventors:
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
A flip chip type semiconductor device comprises at least one first metal line and at least a pair of second metal lines formed in the passivation layer, an aluminum pad covering the first metal line, an aluminum fuse covering the pair of second metal lines adjacent to each other and the passivation layer therebetween, and an under-bump metal layer pattern and a bump formed on the aluminum pad in order. The first and second metal lines are formed respectively in first and second grooves by using a damascene process after forming first and second grooves in the passivation layer.