The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Mar. 18, 2002
Applicant:
Inventors:
Takayoshi Nakamura, Hitachi, JP;
Ryuichi Saito, Hitachi, JP;
Akihiro Tamba, Hitachinaka, JP;
Takashi Naitou, Mito, JP;
Hiroki Yamamoto, Hitachi, JP;
Takashi Namekawa, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/334 ; H01L 2/148 ; H05K 7/20 ;
U.S. Cl.
CPC ...
H01L 2/334 ; H01L 2/148 ; H05K 7/20 ;
Abstract
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said electric insulating material is a bismuth glass layer.