The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Oct. 27, 2000
Applicant:
Inventor:
Kenji Uchiyama, Hotaka-machi, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A method of mounting a component in which a component is thermally press-bonded onto a substrate with a conductive adhesive. The method includes a substrate heating step in which the substrate is heated to a temperature which is 20° C.˜40° C. below the glass transition point of a bonding resin contained in the conductive adhesive, and a thermal press-bonding step in which the component is thermally press-bonded onto the substrate heated to the aforementioned temperature with the conductive adhesive.
Uchiyama, Kenji. (2004). Component mounting method and method of producing electro-optical device (U.S. Patent No. 6767763). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6767763
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile