The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2004
Filed:
Nov. 30, 2001
Tatsuo Nishimoto, Tokyo, JP;
Hoya Corporation, Tokyo, JP;
Abstract
An injection compression molding method for injecting and compressing molten resin to obtain molding product using a molding die internally having a lens-forming cavity includes a pair of relatively movable inserts; a gate; a runner; and a sprue. The molten resin is injected and filled into the cavity and volume of the cavity is reduced by moving one insert toward the other insert after a time period prior to completion of injecting and filling the molten resin. At the time, a gate shut pin is protruded into the gate in synchronization with the movement of the insert to gradually close the opening of the gate. Accordingly, two demands, i.e. lower resistance in filling the cavity with the molten resin and shutting in the molten resin after the molten resin is packed in the cavity, can both be satisfied. This improves productivity and enables the production of mold products having highly accurate configuration and high quality.